- Type
- Public company (KRX 000660)
- Developed by
- SK Group, South Korea
- Founded
- 1983 (as Hyundai Electronic Industrial)
- Headquarters
- Icheon, South Korea
- Key products
- HBM3E, HBM4, DRAM, NAND, Solidigm SSDs
- Market position
- No. 1 in HBM shipments, 2024–2026
- Type
- Public company (KRX 000660)
- Developed by
- SK Group, South Korea
- Founded
- 1983 (as Hyundai Electronic Industrial)
- Headquarters
- Icheon, South Korea
- Key products
- HBM3E, HBM4, DRAM, NAND, Solidigm SSDs
- Market position
- No. 1 in HBM shipments, 2024–2026
History and Background
The company was founded in 1983 as Hyundai Electronic Industrial and became Hynix Semiconductor in 2001 before being acquired by SK Telecom's parent group in 2012 and renamed SK Hynix. Through the 2000s it built scale in commodity DRAM and NAND flash, later acquiring Intel's NAND business (rebranded Solidigm) in 2021.[1]
Its pivotal AI move came in 2015, when it co-developed the first high-bandwidth memory with AMD for the Fiji GPU generation. While competitors treated HBM as a niche product, SK Hynix invested through the downturn and became the lead development partner for NVIDIA's accelerator roadmaps. It mass-produced HBM3E from 2024 and completed the world's first HBM4 development, readying mass production in September 2025 as demand shifted toward NVIDIA's Rubin platform.[2]
Key Concepts
- Why HBM matters for AI. Modern accelerators are limited less by arithmetic than by memory bandwidth. HBM stacks several DRAM dies on a silicon interposer directly beside the processor, giving hundreds of terabytes per second of bandwidth at the cost of a larger, more expensive package. NVIDIA Blackwell and Rubin-class GPUs, Google's TPUs and other accelerators all depend on it.[1]
- Market position. Counterpoint Research ranked SK Hynix No. 1 in HBM shipments with roughly 62% share in mid-2025, easing to about 50% by mid-2026 as Samsung and Micron qualified their own parts. Analysts expect it to hold the majority of the HBM4 segment on NVIDIA's Rubin platform.[3]
- Capacity as strategy. HBM output is constrained by advanced packaging — stacking, through-silicon vias and interposers — rather than by cleanroom wafer starts alone. SK Hynix's early lead in packaging yield is why its capacity has been sold out years in advance, and why memory, not logic chips, has repeatedly been the binding constraint on AI buildouts.[2]
- Broader portfolio. The company remains a major supplier of conventional DDR5 server and mobile DRAM, NAND flash and enterprise SSDs, giving it a cyclical base beneath the AI-driven HBM business.
Applications and Impact
Every leading AI training and inference cluster in the world runs on HBM-equipped accelerators, so SK Hynix's output directly sets the pace of global AI capacity. The HBM market grew from roughly $38 billion in 2025 to an estimated $58 billion in 2026, with projections approaching $100 billion by 2028 as content per accelerator rises.[1] Tight HBM supply has been cited in accelerator lead times, price increases and the emergence of a broader "memory supercycle", and it has reshaped supplier power: memory makers that historically competed on price now negotiate multi-year take-or-pay contracts with hyperscalers and GPU vendors.[3]
>See Also
🇲🇾 Relevance to Malaysia: Malaysia sits at the assembly, test and packaging end of the same supply chain that SK Hynix leads at the front end. Penang and Kulim host global semiconductor ATP operations, and advanced packaging capacity — the technique HBM itself depends on — is exactly where Malaysian firms and the Penang semiconductor and AI ecosystem are climbing the value chain under the New Industrial Master Plan and MDEC's electronics programmes.[4] Malaysia's data-centre build-out (Johor, Cyberjaya, Kedah) also consumes HBM indirectly: every accelerator installed in a Malaysian facility ships with stacked memory, so global supply tightness translates into local compute availability and cost. For Malaysian technology firms, the practical reading is that AI capacity planning must account for memory supply, not just GPU allocation, and that domestic packaging expertise is a strategic asset in the global AI hardware map.[5]
References
- ↑SK hynix. 2026 Market Outlook: Focus on the HBM-Led Memory Supercycle. https://news.skhynix.com/en/2026-market-outlook-focus-on-the-hbm-led-memory-supercycle/
- ↑SK hynix. SK hynix Completes World's First HBM4 Development and Readies Mass Production. September 2025. https://news.skhynix.com/
- ↑Counterpoint Research. Global DRAM and HBM Market Share: Quarterly. https://counterpointresearch.com/en/insights/global-dram-and-hbm-market-share
- ↑Malaysia Digital Economy Corporation (MDEC). Official website. https://www.mdec.my/
- ↑Investment, Trade and Industry Ministry (MITI). New Industrial Master Plan 2030. https://www.miti.gov.my/